Application fields of spherical silicon powder
Spherical silicon powder is an inorganic non-metallic material with unique physical and chemical properties. It plays an important role in many industries due to its small thermal expansion coefficient, small stress concentration, small friction coefficient, good corrosion resistance, chemical stability and low thermal conductivity. The following are some of the main application fields of spherical silicon powder:
Copper clad laminate (CCL):
Spherical silicon powder is widely used in the field of copper clad laminate because of its large surface area and good dispersibility, which can improve the compatibility of epoxy resin and filler. It helps to improve the mechanical and electrical properties of copper clad laminates. It is currently mainly used in rigid CCL, accounting for 20% to 30% of the mixed casting ratio of copper clad laminates.
Epoxy molding compound (EMC):
In the packaging of microelectronic devices, spherical silicon powder, as the main filler of epoxy molding compound, helps to reduce the thermal expansion coefficient, increase thermal conductivity, reduce the dielectric constant, etc., which is crucial to the performance of electronic products.
Honeycomb ceramics:
Spherical silica powder is used to manufacture honeycomb ceramic carriers and diesel engine exhaust filters for automobile exhaust purification, and improve the molding rate and stability of honeycomb ceramic products.
Paints and coatings:
Spherical silica powder can improve the performance of coatings in terms of scratch resistance, leveling, transparency and weather resistance, and is widely used in decorative paints, wood paints, powder coatings, anti-corrosion coatings and floor coatings.
Adhesives:
In the field of adhesives, spherical silica powder can provide appropriate viscosity, excellent thixotropy and anti-sagging properties, enhance bonding strength and fatigue resistance, and is particularly suitable for the bonding of wind turbine blades and large composite structural parts.
Cutting-edge application areas:
Spherical silica powder is also suitable for promoting the fluidity and reducing burrs of resins for semiconductor packaging, as carbon powder additives, silicone rubber fillers, sintering materials and additives, and fillers for liquid packaging materials.
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