At present, the automobile industry has entered a period of great change once in a century, and the electrification of automobiles is becoming a new development trend and trend. Under the wave of electrification, the design of the major systems of the car has undergone earth-shaking changes. Not only the engine and gearbox are undergoing a revolution, but the replacement of the old and new materials and designs of its parts is also rapidly refreshing the entire industrial chain.

At present, advanced ceramic materials are speeding up their "boarding" by virtue of their special performance advantages. From components such as bearings, brake pads, substrates, capacitors, and relays to the efficient cutting and processing of auto parts, the advantages of advanced ceramic materials are fully utilized in the new energy automotive industry.

In electric vehicles, high-power packaged devices play a decisive role in regulating vehicle speed and storing-converting AC and DC. The high-frequency thermal cycle puts forward strict requirements on the heat dissipation of electronic packaging. At the same time, the complexity and diversity of the working environment require packaging materials to have better thermal shock resistance and high strength to play a supporting role.

In recent years, the ceramic substrates that have been mass-produced and widely used mainly include: Al203, Beo, SiC, Si3N4, AIN, etc. Among them, silicon nitride is recognized at home and abroad as the best ceramic substrate material with high thermal conductivity and high reliability. At the same time, the thermal expansion coefficient of the Si3N4 ceramic substrate is close to that of the third-generation semiconductor substrate SiC crystal, making it more stable in matching with the SiC crystal material. This makes Si3N4 the first choice for the high thermal conductivity substrate material of the third generation SiC semiconductor power devices.