As key components in the semiconductor manufacturing process, global demand for precision ceramic components for semiconductor equipment will increase significantly. The following are precision ceramic components commonly used in semiconductor manufacturing processes.

 Commonly Used Advanced Ceramic Materials for Semiconductor Equipment

Photography

The basic principle of photolithography is to use the corrosion resistance of photoresist due to photochemical reaction after exposure to light to engrave patterns on the mask onto the surface to be processed. The process involves high-efficiency, high-precision, and high-stability motion control technology and drive technology, which places extremely high requirements on the accuracy of structural parts and the performance of structural materials.

Silicon carbide ceramic has high elastic modulus and specific stiffness, is not easily deformed, has high thermal conductivity and low thermal expansion coefficient, and has high thermal stability. It is an excellent structural material. It can be used in key equipment for integrated circuit manufacturing such as silicon carbide workpiece tables, guide rails, reflectors, ceramic suckers, arms, etc. for photolithography machines.

Lithography machine workbench

Etching

Etching is an important step in the semiconductor manufacturing process. In semiconductor etching equipment, the plasma etching machine process chamber and the components inside the chamber will be bombarded by high-density and high-energy plasma during the etching process, causing severe corrosion. On the one hand, it will shorten the service life of components and reduce the performance of the equipment. On the other hand, the reactants produced during the corrosion process will volatilize and fall off, producing impurity particles in the cavity, affecting the cleanliness of the cavity.

Advanced ceramic materials have good corrosion resistance and have been widely used in plasma etching resistant materials for wafer processing equipment. High-purity alumina coatings or alumina ceramics are usually used as etching chambers and internal components of the chamber. Protective materials. In addition, precision ceramic components used in plasma etching equipment include window mirrors, gas dispersion disks, nozzles, insulating rings, cover plates, focusing rings and electrostatic chucks, etc.

Plasma etching equipment

Film deposition

A step after etching is also the so-called "thin film deposition", one of the core processes in chip manufacturing. Thin films are often used to produce conductive layers or insulating layers, produce anti-reflective films to increase light absorbance, and temporarily block etching. They have different functions. The needs correspond to films of different materials. Films of different materials require different processes and equipment. According to different principles, they can be divided into physical processes (PVD) and chemical processes (CVD).

Thin film deposition is similar to the reverse process of etching. Since plasma technology and other technologies are also used that can easily cause corrosion to the cavity and components, the chamber cover, cavity lining, deposition ring, electrostatic chuck, heater, and electroplating insulator in the deposition equipment , vacuum breaking filters and other components are made of advanced ceramics as materials.

Metal-organic chemical vapor deposition (MOCVD) reaction chamber

Chemical Mechanical Polishing (CMP)

CMP is a key technology in the semiconductor manufacturing process. With the continuous breakthroughs in process nodes, CMP has become an indispensable planarization process for 0.35μm and below processes, which is related to the subsequent process yield. CMP uses a process that combines mechanical friction and chemical corrosion. Due to the operating principle of CMP equipment, key consumables such as polishing tables, polishing plates, handling arms, and vacuum suction cups will also be lost due to long-term friction and corrosion.

Alumina ceramics and silicon carbide ceramics both have physical properties of density, high hardness, and high wear resistance, as well as good heat resistance and excellent mechanical strength. They still have good insulation and good corrosion resistance in high temperature environments. The physical properties make it an excellent material for making key consumables for CMP equipment.

Chemical Mechanical Planarization (CMP)

Ion Implantation

Due to the poor electrical conductivity of pure silicon materials, wafer manufacturing requires the introduction of doping processes in active areas, substrates, gates, etc. to increase electrical conductivity. Ion implantation is the mainstream doping process in the semiconductor field. It accelerates the ions generated by the ion source through the accelerator of the equipment and then hits the wafer surface at high speed, causing the ions to squeeze into the wafer surface material. Its technical barrier is second only to photolithography and etching. , thin film deposition. In this process, bearings, vacuum suction cups, electrostatic chucks, etc. are all common ceramic precision components.

Air bearings for ion implantation

Interconnection

In the semiconductor packaging process, "Interconnection" is the main method used to realize circuit connections between chips and substrates. In this process, the ceramic riving knife is an essential tool in the wire bonding process. Since a bonding machine needs to bond millions of solder joints every day at full load, ceramic cleavers are used as welding needles in the bonding machine. A bonding machine consumes an average of 0.7 ceramic cleats every day. knife.

At present, the main manufacturing material of ceramic cleavers is alumina. Some manufacturers add zirconia on the basis of alumina. Its microstructure is more uniform and dense, and the density is increased to 4.3g/cm³, which can reduce ceramic cleavage during the wire bonding process. Knife tip wear and frequency of replacement.

A semiconductor equipment seems to be made of metal, plastic and other materials, but in fact there are many highly technical precision ceramic components hidden inside. In addition to these, there are also wafer heat treatment equipment for oxidation, diffusion and annealing. Precision ceramic components are also used. In short, precision ceramics have far more applications in semiconductor equipment than we imagine.

If you need to purchase ceramic semiconductor products, please search for your product on the product page. You can also leave your information on the contact page or send us an email.
Product page:https://www.ceramic-solutions.com/Boron-Nitride.html
Contact page:https://www.ceramic-solutions.com/Contact.html