In the field of semiconductor wafer manufacturing, the application of ceramic polishing plate marks a revolutionary advancement in polishing technology. By implementing a double-sided polishing process, this technology can precisely grind the cut wafers, thereby significantly improving the quality of the wafers. By carefully optimizing the key elements of the polishing process, including polishing plate material, polishing fluid, polishing pressure and rotation speed, we can significantly improve the flatness and overall quality of the wafer surface.
Compared with traditional cast iron discs, the use of ceramic discs can significantly reduce possible damage or contamination to the main surface of the wafer during the polishing process, while also reducing the risk of metal ion contamination. This improvement not only reduces the burden of subsequent wafer processing and shortens the time required for subsequent processes including etching, but also significantly improves production efficiency. In addition, reducing losses during processing also greatly improves wafer utilization.
When selecting ceramic materials, alumina ceramics are preferred due to their required high purity, superior chemical durability, and precise control of surface shape and roughness. Alumina ceramics have become the material of choice for semiconductor manufacturing equipment components due to their outstanding properties, such as high strength and chemical resistance. With the continuous advancement of technology, the application range of alumina ceramics will be further expanded, bringing more possibilities to the semiconductor manufacturing process.
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