Advantage of Boron Nitride Ceramic BN-AlN

BN-AlN is a composite material composed of Boron Nitride (BN) and Aluminum Nitride (AlN). It combines the excellent properties of BN and AlN, such as high thermal conductivity, good electrical insulation, low dielectric constant and excellent thermal stability. This composite material shows great application potential in many fields.

Thermal properties: BN-AlN composite materials combine the high thermal conductivity and low thermal expansion coefficient of BN with the high thermal conductivity and good thermal stability of AlN. By optimizing the microstructure and composition ratio of the material, BN-AlN can further optimize the thermal expansion coefficient while maintaining high thermal conductivity, making it closer to semiconductor materials such as silicon. This feature gives BN-AlN a significant advantage in semiconductor packaging and high-temperature thermal management.

Dielectric properties: BN-AlN composite materials inherit the low dielectric constant and low dielectric loss characteristics of BN, while also having the excellent electrical insulation properties of AlN. This unique combination of dielectric properties makes BN-AlN composite materials perform well in high-frequency electronic devices and microwave transparent materials. For example, in 5G communications and radar systems, BN-AlN can serve as a key insulating and wave-transmitting material to meet the needs of high-performance electronic devices.

Boron Nitride Ceramic BN-AlN Specification