Application of Boron Nitride Ceramic ZSBN

Heat dissipation solutions for electronic components
In the fields of 5G communications and power semiconductors, ZSBN is widely used as a chip heat dissipation substrate and LED packaging material due to its excellent thermal conductivity (>30 W/m·K) and insulation properties, ensuring efficient heat dissipation and safe operation of high-power devices.

High-efficiency lubricating materials in precision machining
ZSBN's self-lubricating properties can replace traditional graphite and be used in metal drawing dies, bearing coatings and other scenarios, reducing the friction coefficient by 60%, especially suitable for ultra-precision cutting in oil-free environments.

Revolutionary materials in the special metallurgical industry
In the continuous casting production of aluminum/magnesium alloys, the separation ring made of ZSBN can avoid metal adhesion and improve the surface finish of the ingot. Its chemical inertness ensures zero contamination when in contact with molten metal, and the purity retention rate exceeds 99.9%.

Aerospace extreme environment resistant components
ZSBN performs stably under extreme conditions such as vacuum, radiation, and ultra-high temperature. It is the preferred material for rocket nozzle coatings and satellite thermal control systems, and has successfully passed the harsh working conditions verification from -196℃ to 1800℃.

Boron Nitride Ceramic ZSBN Specification