Application
Industry: As the Alumina ceramic wafer polishing and sapphire lapping disks used in the semi-conductive, diamond polishing etc.
Process: All types of Polishing and lapping process, such as CMP chemical mechanical polishing, Mechanical Polishing, Precision Polishing.
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Property |
Unit | Value |
| General Properties | Al2O3 content | wt% | 99.7-99.9 |
| Density | gm/cc | 3.94-3.97 | |
| Color | - | Ivory | |
| Water absorption | % | 0 | |
| Mechanical Properties | Flexural Strength(MOR) 20℃ | Mpa(psix10^3) | 440-550 |
| Elastic Modulus 20℃ | GPa(psix10^6) | 375 | |
| Vickers Hardness | Gpa(kg/mm2) R45N | >=17 | |
| Bending Strength | Gpa | 390 | |
| Tensile Strength 25℃ | MPa(psix10^3) | 248 | |
| Fracture Toughness(KIc) | Mpa*m^1/2 | 4-5 | |
| Thermal Properities | Thermal conductivity(20℃) | W/mk | 30 |
| Coefficient of Thermal expansion(25-1000℃) | 1x 10^-6/℃ | 7.6 | |
| Thermal Shock Resistance | ℃ | 200 | |
| Maximum use temperature | ℃ | 1700 | |
| Electrical Properities | Dielectric Strength(1MHz) | ac-kv/mm(acv/mil) | 8.7 |
| Dielectric Constant(1 MHz) | 25℃ | 9.7 | |
| Volume Resistivity | ohm-cm(25°C) | >10^14 | |
| Volume Resistivity | ohm-cm(500°C) | 2x10^12 | |
| Volume Resistivity | ohm-cm(1000°C) |
2x10^7 |
